TAIPEI -- Intel, Taiwan Semiconductor Manufacturing Co. and Samsung will work together to establish an industry standard for advanced chip-packaging technologies, the next key battleground in the race to build more powerful electronics devices.
The world's three biggest chipmakers, along with several other leading tech companies, announced on Thursday that they will form a consortium for collaboration on next-generation chip packaging and stacking, the last steps in semiconductor manufacturing before chips are mounted onto print circuit boards and assembled into electronic devices.
